NTHS4101PMOSFET Power,P-Channel, ChipFET-20 V, 6.7 AFeatures Offers an Ultra Low RDS(on) Solution in the ChipFET Packagehttp://onsemi.com Miniature ChipFET Package 40% Smaller Footprint than TSOP-6making it an Ideal Device for Applications where Board Space is at a V(BR)DSS RDS(on) TYP ID MAXPremium21 mW @ -4.5 V Low Profile (

NTHS4101PPower MOSFET-20 V, 6.7 A, P-Channel ChipFETtFeatures Offers an Ultra Low RDS(on) Solution in the ChipFET Package Miniature ChipFET Package 40% Smaller Footprint than TSOP-6http://onsemi.commaking it an Ideal Device for Applications where Board Space is at aPremiumV(BR)DSS RDS(on) TYP ID MAX Low Profile (

NTHS4101PPower MOSFET-20 V, 6.7 A, P-Channel ChipFETtFeatures Offers an Ultra Low RDS(on) Solution in the ChipFET Package Miniature ChipFET Package 40% Smaller Footprint than TSOP-6http://onsemi.commaking it an Ideal Device for Applications where Board Space is at aPremiumV(BR)DSS RDS(on) TYP ID MAX Low Profile (

NTHS4111PPower MOSFET-30 V, -6.1 A, Single P-Channel, ChipFETtFeatures Offers an Ultra Low RDS(on) Solution in the ChipFET Packagehttp://onsemi.com ChipFET Package 40% Smaller Footprint than TSOP-6 Low Profile (

NTHS4166NPower MOSFET30 V, 8.2 A, Single N-Channel, ChipFETt PackageFeatureshttp://onsemi.com Trench Technology Low RDS(on) to Minimize Conduction Losses Leadless ChipFET Package has 40% Smaller Footprint than TSOP-6V(BR)DSS RDS(on) Max ID Max Excellent Thermal Capabilities22 mW @ 10 V This is a Pb-Free Device30 V 8.2 A27 mW @ 4.5 VApplications