RJP63F3DPP-M0 Datasheet. Equivalente

 ..1. Size:159K  renesas
 rjp63f3dpp-m0.pdf

Preliminary Datasheet RJP63F3DPP-M0 R07DS0321EJ0200 Silicon N Channel IGBT Rev.2.00 High Speed Power Switching May 26, 2011 Features Trench gate and thin wafer technology (G6H series) Low collector to emitter saturation voltage VCE(sat) = 1.7 V typ High speed switching tf = 100 ns typ Low leak current ICES = 1 A max Isolated package TO-220FL Outline

 4.1. Size:179K  renesas
 r07ds0321ej rjp63f3dpp.pdf

Preliminary Datasheet RJP63F3DPP-M0 R07DS0321EJ0200 Silicon N Channel IGBT Rev.2.00 High Speed Power Switching May 26, 2011 Features Trench gate and thin wafer technology (G6H series) Low collector to emitter saturation voltage VCE(sat) = 1.7 V typ High speed switching tf = 100 ns typ Low leak current ICES = 1 A max Isolated package TO-220FL Outline

 9.1. Size:145K  renesas
 r07ds0468ej rjp63k2dpp.pdf

Preliminary Datasheet RJP63K2DPP-M0 R07DS0468EJ0200 Silicon N Channel IGBT Rev.2.00 High Speed Power Switching Jun 15, 2011 Features Trench gate and thin wafer technology (G6H-II series) Low collector to emitter saturation voltage VCE(sat) = 1.9 V typ High speed switching tr = 60 ns typ, tf = 200 ns typ. Low leak current ICES = 1 A max Isolated pa

 9.2. Size:124K  renesas
 rjp63k2dpp-m0.pdf

Preliminary Datasheet RJP63K2DPP-M0 R07DS0468EJ0200 Silicon N Channel IGBT Rev.2.00 High Speed Power Switching Jun 15, 2011 Features Trench gate and thin wafer technology (G6H-II series) Low collector to emitter saturation voltage VCE(sat) = 1.9 V typ High speed switching tr = 60 ns typ, tf = 200 ns typ. Low leak current ICES = 1 A max Isolated pa

 9.3. Size:124K  renesas
 rjp63k2dpk-m0.pdf

Preliminary Datasheet RJP63K2DPK-M0 R07DS0469EJ0200 Silicon N Channel IGBT Rev.2.00 High speed power switching Jun 15, 2011 Features Trench gate and thin wafer technology (G6H-II series) Low collector to emitter saturation voltage VCE(sat) = 1.9 V typ High speed switching tr = 60 ns typ, tf = 200 ns typ. Low leak current ICES = 1 A max Outline RENES

 9.4. Size:155K  renesas
 r07ds0469ej rjp63k2dpk.pdf

Preliminary Datasheet RJP63K2DPK-M0 R07DS0469EJ0200 Silicon N Channel IGBT Rev.2.00 High speed power switching Jun 15, 2011 Features Trench gate and thin wafer technology (G6H-II series) Low collector to emitter saturation voltage VCE(sat) = 1.9 V typ High speed switching tr = 60 ns typ, tf = 200 ns typ. Low leak current ICES = 1 A max Outline RENES