G11 Datasheet and Replacement

(96-384-A123J

GOFORD G11General DescriptionThe G11 uses advanced trench technology to provide SOP-8excellent RDS(ON), low gate charge and operation with gatevoltages as low as 1.8V. This device is suitable for use asa load switch.With ESD.Product SummaryPin1VDSS RDS(ON) RDS(ON) ID(Typ) @-2.5V @-4.5V (Typ)-12V12 m 21m -12 ASchematic diagramAbsolute Maximum Ratings TA=25

HYG110P04LQ2C2 Single P-Channel Enhancement Mode MOSFET Feature Description Pin Description -40V/-55A D D D D D D D D RDS(ON)= 9.0 m (typ.) @VGS = - 10V RDS(ON)= 13.0 m (typ.) @VGS = - 4.5V 100% Avalanche Tested Reliable and Rugged Halogen- Free Devices Available G S S S S S S G Pin1 PDFN5*6-8L Applications Switching Application Powe

PD-90396HIRFG110JANTX2N7334JANTXV2N7334POWER MOSFETREF:MIL-PRF-19500/597THRU-HOLE (MO-036AB) 100V, QUAD N-CHANNELHEXFET MOSFET TECHNOLOGYProduct SummaryPart Number RDS(on) IDIRFG110 0.7 1.0AHEXFET MOSFET technology is the key to InternationalRectifiers advanced line of power MOSFET transistors.The efficient geometry design achieves very low on-stateres

DISCRETE SEMICONDUCTORSDATA SHEETBFG11W/XNPN 2 GHz power transistor1996 Jun 04Product specificationSupersedes data of September 1995File under Discrete Semiconductors, SC14Philips Semiconductors Product specificationNPN 2 GHz power transistor BFG11W/XFEATURES PINNING - SOT343 High power gainPIN DESCRIPTION High efficiency1 collector Small size discrete po

DISCRETE SEMICONDUCTORSDATA SHEETBFG11; BFG11/XNPN 2 GHz RF power transistor1995 Apr 07Product specificationSupersedes data of November 1992File under Discrete Semiconductors, SC14Philips SemiconductorsPhilips Semiconductors Product specificationNPN 2 GHz RF power transistor BFG11; BFG11/XFEATURES DESCRIPTION High power gain NPN silicon planar epitaxial transistors e

SSM5G11TU Silicon P Channel MOS Type (U-MOS)/Silicon Epitaxial Schottky Barrier Diode SSM5G11TU DC-DC Converter Applications 4-V driveUnit: mm Combined a P-ch MOSFET and a Schottky barrier diode in one package. Low RDS (ON) and Low VF Absolute Maximum Ratings MOSFET (Ta = 25C) Characteristic Symbol Rating UnitDrain-source voltage VDSS -30 VGate-source vol

TIG110BFOrdering number : EN9013ASANYO SemiconductorsDATA SHEETN-Channel Non Punch Through IGBTTIG110BFHigh Power High Speed Switching ApplicationsFeatures Low-saturation voltage Ultrahigh speed switching Enhansment typeSpecificationsAbsolute Maximum Ratings at Ta=25C, Unless otherwise specifiedParameter Symbol Conditions Ratings UnitCollector-to-Emitter

TIG110GMHOrdering number : EN9018SANYO SemiconductorsDATA SHEETN-Channel Non Punch Through IGBTTIG110GMHHigh Power High Speed Switching ApplicationsFeatures Low-saturation voltage Ultrahigh speed switching Enhansment typeSpecificationsAbsolute Maximum Ratings at Ta=25C, Unless otherwise specifiedParameter Symbol Conditions Ratings UnitCollector-to-Emitte

TIG111BFOrdering number : EN9017ASANYO SemiconductorsDATA SHEETN-Channel Non Punch Through IGBTTIG111BFHigh Power High Speed Switching ApplicationsFeatures Low-saturation voltage Ultrahigh speed switching Enhansment typeSpecificationsAbsolute Maximum Ratings at Ta=25C, Unless otherwise specifiedParameter Symbol Conditions Ratings UnitCollector-to-Emitter

TIG111GMHOrdering number : EN9014SANYO SemiconductorsDATA SHEETN-Channel Non Punch Through IGBTTIG111GMHHigh Power High Speed Switching ApplicationsFeatures Low-saturation voltage Ultrahigh speed switching Enhansment typeSpecificationsAbsolute Maximum Ratings at Ta=25C, Unless otherwise specifiedParameter Symbol Conditions Ratings UnitCollector-to-Emitte

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To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.

To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid Renesas Electronics document. We appreciate your understanding.

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HGTG11N120CNDData Sheet December 200143A, 1200V, NPT Series N-Channel IGBT Featureswith Anti-Parallel Hyperfast Diode 43A, 1200V, TC = 25oCThe HGTG11N120CND is a Non-Punch Through (NPT) 1200V Switching SOA CapabilityIGBT design. This is a new member of the MOS gated high Typical Fall Time. . . . . . . . . . . . . . . . 340ns at TJ = 150oCvoltage switching IGBT famil

HGTG11N120CN, HGTP11N120CN,HGT1S11N120CNSData Sheet December 200143A, 1200V, NPT Series N-Channel IGBT FeaturesThe HGTG11N120CN, HGTP11N120CN, and 43A, 1200V, TC = 25oCHGT1S11N120CNS are Non-Punch Through (NPT) IGBT 1200V Switching SOA Capabilitydesigns. They are new members of the MOS gated high Typical Fall Time. . . . . . . . . . . . . . . . 340ns at TJ = 150oC

EMG11 / UMG11N / FMG11ATransistorsEmitter common (dual digital transistors)EMG11 / UMG11N / FMG11A External dimensions (Units : mm) Features1) Two DTA123Js chips in a EMT or UMT or SMTEMG11 package.(4) (3)( )2( ) ( )5 11.21.6 Equivalent circuitEach lead has same dimensionsEMG11 / UMG11N FMG11AROHM : EMT5(3) (2) (1) (3) (4) (5)R1 R1 R1 R1R2 R2 R2 R2U

HGTG11N120CNDData Sheet December 200143A, 1200V, NPT Series N-Channel IGBT Featureswith Anti-Parallel Hyperfast Diode 43A, 1200V, TC = 25oCThe HGTG11N120CND is a Non-Punch Through (NPT) 1200V Switching SOA CapabilityIGBT design. This is a new member of the MOS gated high Typical Fall Time. . . . . . . . . . . . . . . . 340ns at TJ = 150oCvoltage switching IGBT famil

EMG11 Dual N-Ch Digital Transistors (Built-in Resistors) Elektronische Bauelemente RoHS Compliant Product A suffix of -C specifies halogen & lead-free FEATURES SOT-553 Two DTC123JCA chips in a package AEQUIVALENT CIRCUIT BJD G HF ECMillimeter MillimeterREF. REF. Min. Max. Min. Max.A 1.50 1.70 F 0.09 0.16B 1.50 1.70 G 0.45 0.55C 0.525 0.60 H 0.17

GOFORD G110N06KGeneral Description The G110N06 is N-channel MOS Field Effect Transistor designed for high current switching applications. Rugged EAS capability and ultra low R is suitable for PWM, load DS(ON)switching applications. Features VDSS RDS(ON) IDSchematic diagram @10V (Typ)55V 5.2 m 110A Ultra Low On-Resistance High UIS and UIS 100% Tes

GOFORD G110N06 General Description The G110N06 is N-channel MOS Field Effect Transistor designed for high current switching applications. Rugged EAS capability and ultra low R is suitable for PWM, load DS(ON)switching applications. Features VDSS RDS(ON) ID @10V (Typ)TO-252 TO-251 55V 5.2 m 110A Ultra Low On-Resistance High UIS and UIS 100% Test

GOFORD G110N06 General Description The G110N06 is N-channel MOS Field Effect Transistor designed for high current switching applications. Rugged EAS capability and ultra low R is suitable for PWM, load DS(ON)switching applications. Features Schematic diagram VDSS RDS(ON) ID @10V (Typ)55V 5.2 m 110A Ultra Low On-Resistance High UIS and UIS 100% Te

GOFORDG110N06.Description The G110N06. uses advanced trench technology and design to provide excellent R with low gate charge. It DS(ON) can be used in a wide variety of applications. General Features Schematic diagram VDSS RDS(ON) RDS(ON) ID @4.5V (Typ) @ 10V (Typ)m m 11055V 5.8 5.4 A High density cell design for ultra low Rdson Fully characteriz

3CG110 PNP A B C D E F G PCM 300 mW ICM 50 mA Tjm 175 Tstg -55~150 V(BR)CBO ICB=0.1mA 20 35 50 65 80 95 110 V V(BR)CEO ICE=0.1mA 15 30 45 60 75 90 105 V V(BR)EBO IEB=0.1mA 4.0 V ICBO VCB=10V 0.1 A ICEO VCE=10V 0.

3CG1124 PNP PCM TA=25 500 mW ICM 3 A Tjm 150 Tstg -55~150 V(BR)CBO ICB=10uA 60 V V(BR)CEO ICE=1mA 50 V V(BR)EBO IEB=10uA 6.0 V ICBO VCB=40V 1 A IEBO VEB=4V 1 A VBEsat 1.2 IC=2A V IB=100mA VCEsat 0.7 VCE=2V hFE 100~5

4SDG110 NPN A B C PCM Ta=25 3004 mW ICM 50 mA Tjm 175 Tstg -55~150 V(BR)CBO ICB=0.1mA 25 35 50 V V(BR)CEO ICE=0.1mA 20 30 45 V V(BR) EBO IEB=0.1mA 4.0 V ICBO VCB=10V 0.01 A ICEO VCE=10V 0.1 A IEBO VEB=2V 0.1 A

4SCG110 PNP A B C PCM Ta=25 3004 mW ICM 50 mA Tjm 175 Tstg -55~150 V(BR)CBO ICB=0.1mA 25 35 50 V V(BR)CEO ICE=0.1mA 20 30 45 V V(BR) EBO IEB=0.1mA 5.0 V ICBO VCB=10V 0.01 A ICEO VCE=10V 0.1 A IEBO VEB=2V 0.1 A

3CG112 PNP A B C D E F G PCM 300 mW ICM 50 mA Tjm 175 Tstg -55~150 V(BR)CBO ICB=0.1mA 20 35 50 65 80 95 110 V V(BR)CEO ICE=0.1mA 15 30 45 60 75 90 105 V V(BR)EBO IEB=0.1mA 4.0 V ICBO VCB=10V 0.1 A ICEO VCE=10V 0

3DG117B NPN PCM TA=25 300 mW ICM 30 mA Tjm 175 Tstg -55~175 V(BR)CBO ICB=0.1mA 160 V V(BR)CEO ICE=0.1mA 160 V V(BR)EBO IEB=0.1mA 4.0 V ICEO VCE=10V 0.1 A IC=10mA VCEsat 0.7 V IB=1mA VCE=10V hFE 30 IC=5mA VCE=10V

SCG118 PNP A B C PCM 1002 mW ICM Ta=25 50 mA Tjm 175 Tstg -55~150 V(BR)CBO ICB=0.01mA 30 45 60 V V(BR)CEO ICE=0.01mA 20 30 45 V V(BR) EBO IEB=0.01mA 6.0 V ICBO VCB=10V 0.01 A ICEO VCE=10V 0.1 A IEBO VEB=3V 0.1 A

3DG112 NPN A B C D PCM 300 mW ICM 50 mA Tjm 175 Tstg -55~150 V(BR)CBO ICB=0.1mA 20 40 20 40 V V(BR)CEO ICE=0.1mA 15 30 15 30 V V(BR)EBO IEB=0.1mA 4.0 V ICBO VCB=10V 0.1 A ICEO VCE=10V 0.1 A IEBO VEB=1.5V 0.1 A

3CG114B PNP PCM TA=25 1.0 W ICM 1.0 A Tjm 175 Tstg -55~150 V(BR)CBO ICB=0.1mA 60 V V(BR)CEO ICE=0.1mA 60 V V(BR)EBO IEB=0.1mA 5.0 V ICBO VCB=30V 1.0 A ICEO VCE=30V 1.0 A VBEsat 0.5 IC=500mA V IB=50mA VCEsat 1.5 VCE=2V

3DG111 NPN A B C D PCM 300 mW ICM 50 mA Tjm 175 Tstg -55~150 V(BR)CBO ICB=0.1mA 20 40 60 80 V V(BR)CEO ICE=0.1mA 15 30 45 60 V V(BR)EBO IEB=0.1mA 5.0 V ICBO VCB=10V 0.1 A ICEO VCE=10V 0.1 A IEBO VEB=1.5V 0.1 A

4SDG110K NPN A B C PCM Ta=25 3004 mW ICM 50 mA Tjm 175 Tstg -55~150 V(BR)CBO ICB=0.1mA 25 35 50 V V(BR)CEO ICE=0.1mA 20 30 45 V V(BR) EBO IEB=0.1mA 5.0 V ICBO VCB=10V 0.1 A ICEO VCE=10V 0.2 A IEBO VEB=2V 0.2 A

3DG114B NPN PCM TA=25 1000 mW ICM 1000 mA Tjm 175 Tstg -55~150 V(BR)CBO ICB=0.1mA 60 V V(BR)CEO ICE=0.1mA 60 V V(BR)EBO IEB=0.1mA 5.0 V ICBO VCB=30V 1.0 A ICEO VCE=30V 1.0 A VBEsat 0.5 IC=500mA V IB=50mA VCEsat 1.5 VC

3DG110 NPN A B C D PCM 300 mW ICM 50 mA Tjm 175 Tstg -55~150 V(BR)CBO ICB=0.1mA 40 60 40 60 V V(BR)CEO ICE=0.1mA 30 45 30 45 V V(BR)EBO IEB=0.1mA 5.0 V ICBO VCB=10V 0.03 A ICEO VCE=10V 0.5 A IEBO VEB=1.5V 0.05 A

3CG111 PNP A B C D E F G PCM 300 mW ICM 50 mA Tjm 175 Tstg -55~150 V(BR)CBO ICB=0.1mA 20 35 50 65 80 95 110 V V(BR)CEO ICE=0.1mA 15 30 45 60 75 90 105 V V(BR)EBO IEB=0.1mA 4.0 V ICBO VCB=10V 0.1 A ICEO VCE=10V 0.

CHENMKO ENTERPRISE CO.,LTDCHEMG11GPSURFACE MOUNTDual Digital Silicon TransistorVOLTAGE 50 Volts CURRENT 100 mAmpereAPPLICATION* Switching circuit, Inverter, Interface circuit, Driver circuit.FEATURE* Small surface mounting type. (SOT-553)SOT553* High current gain. * Suitable for high packing density.* Low colloector-emitter saturation.(4) (3)* High saturation current

CHENMKO ENTERPRISE CO.,LTDCHUMG11GPSURFACE MOUNTDual Digital Silicon TransistorVOLTAGE 50 Volts CURRENT 100 mAmpereAPPLICATION* Switching circuit, Inverter, Interface circuit, Driver circuit.FEATURE* Small surface mounting type. (SC-88A/SOT-353)SC-88A/SOT353* High current gain. * Suitable for high packing density.* Low colloector-emitter saturation.* High saturation cu

CHENMKO ENTERPRISE CO.,LTDCHFMG11GPSURFACE MOUNTDual Digital Silicon TransistorVOLTAGE 50 Volts CURRENT 100 mAmpereAPPLICATION* Switching circuit, Inverter, Interface circuit, Driver circuit.FEATURE* Small surface mounting type. (SC-74A)SC-74A* High current gain. * Suitable for high packing density.* Low colloector-emitter saturation.* High saturation current capabilit

2SC1162(3DG1162) NPN /SILICON NPN TRANSISTOR :/Purpose: Low frequency power amplifier. : 2SA715(3CG715)/Features: Complementary pair with 2SA715(3CG715). /Absolute maximum ratings(Ta=25) Symbol Rating Unit V 35 V CBO V 35 V CEO V 5.0 V EBO I 2.5 A C I 3.0 A

HYG110P04LQ2 D/U/V P-Channel Enhancement Mode MOSFET Feature Pin Description -40V/-50ARDS(ON)= 9.4m(typ.) @VGS = -10V RDS(ON)= 13 m(typ.) @VGS = -4.5V SDSGD 100% avalanche testedGS Reliable and Rugged DG Halogen Free and Green Devices Available (RoHS Compliant) TO-252-2L TO-251-3L TO-251-3S Applications Switching application Power Management in

2SB1198K(3CG1198K) PNP /SILICON PNP TRANSISTOR Purpose: Medium power amplifier applications. :, 2SD1782K(3DG1782K) Features: High breakdown,low V ,complements the 2SD1782K(3DG1782K). CE(sat)/Absolute maximum ratings(Ta=25) Sym

2SA1128(3CG1128) PNP /SILICON PNP TRANSISTOR :/Purpose: Audio frequency output amplifier. :, 2SC1788(3DG1788) Features: low V ,complementary pair with 2SC1788(3DG1788). CE(sat)/Absolute maximum ratings(Ta=25) Symbol Rating Unit V -25 V CBO V -20 V CEO

2SB1132(3CG1132) PNP /SILICON PNP TRANSISTOR Purpose: Medium power amplifier applications. , 2SD1664(3DG1664) Features: Low saturation voltage, complements the 2SD1664(3DG1664). /Absolute maximum ratings(Ta=25) Symbol Rating Unit VCBO -40 V

2SA1160(3CG1160) PNP /SILICON PNP TRANSISTOR :, Purpose: Strobe flash,medium power amplifier applications. , Features: High DC current gain and excellent hFE linearity,low saturation voltage. /Absolute maximum ratings(Ta=25)

2SB1189(3CG1189) PNP /SILICON PNP TRANSISTOR Purpose: Medium power amplifier applications. :, 2SD1767(3DG1767) Features: Low V complements the 2SD1767(3DG1767). CE(sat),/Absolute maximum ratings(Ta=25) Symbol Rating Unit V -80 V CBO V -80 V C

2SB1188(3CG1188) PNP /SILICON PNP TRANSISTOR Purpose: Medium power amplifier applications. :, 2SD1766(3DG1766) Features: Low V complements the 2SD1766(3DG1766). CE(sat),/Absolute maximum ratings(Ta=25) Symbol Rating Unit V -40 V CBO V -32 V C

2SA1175(3CG1175) PNP /SILICON PNP TRANSISTOR :/Purpose: Driver stage of audio frequency amplifier. :,, 2SC2785(3DG2785) Features: High voltage and excellent h linearity, complementary pair with 2SC2785(3DG2785). FE/Absolute maximum ratings(Ta=25)

2SB1182(3CG1182) PNP /SILICON PNP TRANSISTOR Purpose: Medium power amplifier applications. :, 2SD1758(3DG1758) Features: Low V complements the 2SD1758(3DG1758). CE(sat),/Absolute maximum ratings(Ta=25) Symbol Rating Unit V -40 V CBO V -32 V

2SA1162(3CG1162) PNP /SILICON PNP TRANSISTOR :/Purpose:Audio frequency general purpose amplifier applications. :,,,, 2SC2712(3DG2712) Features:High voltage and current,excellent h linearity,high h ,low noise,complementary FE FEto 2SC2712(3

2SB1197K(3CG1197K) PNP /SILICON PNP TRANSISTOR : Purpose: Low frequency amplifier applications. :, 2SD1781K(3DG1781K) Features: Low V ,complements the 2SD1781K(3DG1781K). CE(sat)/Absolute maximum ratings(Ta=25) Symbol Rating Unit V -40 V CBO V -32