All MOSFET. STP4953 Datasheet

 

STP4953 Datasheet and Replacement


   Type Designator: STP4953
   Type of Transistor: MOSFET
   Type of Control Channel: P -Channel
   Pd ⓘ - Maximum Power Dissipation: 2.7 W
   |Vds|ⓘ - Maximum Drain-Source Voltage: 30 V
   |Vgs|ⓘ - Maximum Gate-Source Voltage: 20 V
   |Id| ⓘ - Maximum Drain Current: 5.2 A
   Tj ⓘ - Maximum Junction Temperature: 150 °C
   tr ⓘ - Rise Time: 10 nS
   Cossⓘ - Output Capacitance: 120 pF
   Rds ⓘ - Maximum Drain-Source On-State Resistance: 0.06 Ohm
   Package: SOP-8
 

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STP4953 Datasheet (PDF)

 ..1. Size:485K  stansontech
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STP4953

STP4953 Dual P Channel Enhancement Mode MOSFET -5.2A DESCRIPTION STP4953 is the dual P-Channel logic enhancement mode power field effect transistor which is produced using high cell density, DMOS trench technology. This high density process is especially tailored to minimize on-state resistance. These devices are particularly suited for low voltage application such as LCD backli

 0.1. Size:386K  semtron
stp4953a.pdf pdf_icon

STP4953

STP4953A -30V Dual P-Channel Fast Switching MOSFETsDESCRIPTIONFEATUREThe STP4953A is the Dual P-Channel logic -30V/-5.3A, RDS(ON) =46m(typ.)@VGS =-10V enhancement mode power field effect transistor is -30V/-3.6A, RDS(ON) =75m(typ.)@VGS =-4.5V produced using high cell density. advanced trench Super high density cell design for extremely low technology

 9.1. Size:431K  stansontech
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STP4953

STP4925 Dual P Channel Enhancement Mode MOSFET -7.2A DESCRIPTION STP4925 is the dual P-Channel logic enhancement mode power field effect transistor are produced using high cell density, DMOS trench technology. This high density process is especially tailored to minimize on-state resistance. These devices are particularly suited for low voltage application, notebook computer power

 9.2. Size:325K  stansontech
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STP4953

STP4931STP4931STP4931STP4931Dual P Channel Enhancement Mode MOSFET-8.5ADESCRIPTIONDESCRIPTIONDESCRIPTIONDESCRIPTIONSTP4931 is the dual P-Channel logic enhancement mode power field effect transistorsare produced using high cell density, DMOS trench technology. This high densityprocess is especially tailored to minimize on-state resistance. These devices areparticularly

Datasheet: STP45N10F7 , STP45N65M5 , STP45NE06 , STP45NE06FP , STP46NF30 , STP4803 , STP4925 , STP4931 , AON6414A , STP4953A , STP4N80K5 , STP4NA90 , STP4NA90FI , STP4NB100 , STP4NB50 , STP4NB80 , STP4NM60 .

History: IRF7453PBF | SE100250GTS | IRLR7821C | SM1A23NSU | SI2324DS | STP23NM60N | CS6N60A7H

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