MMN9926BDY
MOSFET. Datasheet pdf. Equivalent
Type Designator: MMN9926BDY
Type of Transistor: MOSFET
Type of Control Channel: N
-Channel
Pdⓘ
- Maximum Power Dissipation: 2
W
|Vds|ⓘ - Maximum Drain-Source Voltage: 20
V
|Vgs|ⓘ - Maximum Gate-Source Voltage: 12
V
|Vgs(th)|ⓘ - Maximum Gate-Threshold Voltage: 1.5
V
|Id|ⓘ - Maximum Drain Current: 8.2
A
Tjⓘ - Maximum Junction Temperature: 150
°C
Qgⓘ - Total Gate Charge: 8.7
nC
trⓘ - Rise Time: 4.92
nS
Cossⓘ -
Output Capacitance: 159.36
pF
Rdsⓘ - Maximum Drain-Source On-State Resistance: 0.02
Ohm
Package:
SO-8
TSSOP-8
MMN9926BDY
Transistor Equivalent Substitute - MOSFET Cross-Reference Search
MMN9926BDY
Datasheet (PDF)
..1. Size:203K m-mos
mmn9926bdy.pdf
MMN9926BDYPreliminary Data SheetM-MOS Semiconductor Hong Kong Limited20V N-Channel Enhancement-Mode MOSFETVDS= 20VRDS(ON), Vgs@4.5V, Ids@8.2A = 20mRDS(ON), Vgs@2.5V, Ids@3.3A = 30mFeaturesAdvanced trench process technologyHigh Density Cell Design For Ultra Low On-ResistanceHigh Power and Current handing capabilityIdeal for Li ion battery pack applicationsTSSOP-08 S
7.1. Size:201K m-mos
mmn9926e.pdf
MMN9926EData SheetM-MOS Semiconductor Hong Kong Limited20V Dual N-Channel Enhancement-Mode MOSFETVDS= 20V ID= 8A ESD Protected Gate: 2000VRDS(ON), Vgs@4.5V, Ids@8A = 21mRDS(ON), Vgs@2.5V, Ids@7A = 25mRDS(ON), Vgs@1.8V, Ids@6A = 33mFeaturesAdvanced trench process technologyHigh Density Cell Design For Ultra Low On-ResistanceSpecially Designed for Li ion battery pac
7.2. Size:205K m-mos
mmn9926.pdf
MMN9926Data SheetM-MOS Semiconductor Hong Kong Limited20V N-Channel Enhancement-Mode MOSFETVDS= 20VRDS(ON), Vgs@4.5V, Ids@6A = 30mRDS(ON), Vgs@2.5V, Ids@5.2A = 40mFeaturesAdvanced trench process technologyHigh Density Cell Design For Ultra Low On-ResistanceHigh Power and Current handing capabilityIdeal for Li ion battery pack applicationsTSSOP-08 SO-8 Internal Sche
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