FDG6332C Datasheet and Replacement

September 2003FDG6332C20V N & P-Channel PowerTrench MOSFETsGeneral Description FeaturesThe N & P-Channel MOSFETs are produced using Q1 0.7 A, 20V. RDS(ON) = 300 m @ VGS = 4.5 VFairchild Semiconductors advanced PowerTrenchRDS(ON) = 400 m @ VGS = 2.5 Vprocess that has been especially tailored to minimizeon-state resistance and yet maintain superior Q2

March 2009FDG6332C_F08520V N & P-Channel PowerTrench MOSFETsFeatures General DescriptionThe N & P-Channel MOSFETs are produced using Q1 0.7 A, 20V. RDS(ON) = 300 m @ VGS = 4.5 VFairchild Semiconductors advanced PowerTrenchRDS(ON) = 400 m @ VGS = 2.5 Vprocess that has been especially tailored to minimizeon-state resistance and yet maintain superior Q2

Is Now Part ofTo learn more about ON Semiconductor, please visit our website at www.onsemi.comPlease note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductors system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclatur

FDG6332C-F08520V N & P-Channel PowerTrench MOSFETsGeneral DescriptionFeaturesThe N & P-Channel MOSFETs are produced using Q1 0.7 A, 20V. RDS(ON) = 300 m @ VGS = 4.5 VON Semiconductors advanced PowerTrench RDS(ON) = 400 m @ VGS = 2.5 Vprocess that has been especially tailored to minimize on-state resistance and yet maintain superior switching performance.

October 2001FDG6335N20V N-Channel PowerTrench MOSFETGeneral Description FeaturesThis N-Channel MOSFET has been designed 0.7 A, 20 V. RDS(ON) = 300 m @ VGS = 4.5 Vspecifically to improve the overall efficiency of DC/DCRDS(ON) = 400 m @ VGS = 2.5 Vconverters using either synchronous or conventionalswitching PWM controllers. It has been optimized use Low gat

Is Now Part ofTo learn more about ON Semiconductor, please visit our website at www.onsemi.comPlease note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductors system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclatur