Справочник IGBT. RJP30H1DPP-M0

 

RJP30H1DPP-M0 - IGBT справочник. Даташиты. Аналоги. Параметры и характеристики.


   Наименование: RJP30H1DPP-M0
   Тип транзистора: IGBT
   Тип управляющего канала: N
   Pcⓘ - Максимальная рассеиваемая мощность: 20 W
   |Vce|ⓘ - Предельно-допустимое напряжение коллектор-эмиттер: 360 V
   |Vge|ⓘ - Максимально допустимое напряжение эмиттер-затвор: 30 V
   |Ic|ⓘ - Максимальный постоянный ток коллектора: 30 A @25℃
   |VCEsat|ⓘ - Напряжение насыщения коллектор-эмиттер типовое: 1.5 V @25℃
   Tjⓘ - Максимальная температура перехода: 150 ℃
   trⓘ - Время нарастания типовое: 80 nS
   Coesⓘ - Выходная емкость, типовая: 40 pF
   Qgⓘ - Общий заряд затвора, typ: 23 nC
   Тип корпуса: TO220F

 Аналог (замена) для RJP30H1DPP-M0

 

 

RJP30H1DPP-M0 Datasheet (PDF)

 ..1. Size:130K  renesas
 rjp30h1dpp-m0.pdf

RJP30H1DPP-M0 RJP30H1DPP-M0

Preliminary Datasheet RJP30H1DPP-M0 R07DS0466EJ0200Silicon N Channel IGBT Rev.2.00High speed power switching Jun 15, 2011Features Trench gate and thin wafer technology (G6H-II series) High speed switching: tr =80 ns typ., tf = 150 ns typ. Low collector to emitter saturation voltage: VCE(sat)= 1.5 V typ. Low leak current: ICES = 1 A max. Isolated p

 4.1. Size:151K  renesas
 r07ds0466ej rjp30h1dpp.pdf

RJP30H1DPP-M0 RJP30H1DPP-M0

Preliminary Datasheet RJP30H1DPP-M0 R07DS0466EJ0200Silicon N Channel IGBT Rev.2.00High speed power switching Jun 15, 2011Features Trench gate and thin wafer technology (G6H-II series) High speed switching: tr =80 ns typ., tf = 150 ns typ. Low collector to emitter saturation voltage: VCE(sat)= 1.5 V typ. Low leak current: ICES = 1 A max. Isolated p

 5.1. Size:130K  renesas
 rjp30h1dpd.pdf

RJP30H1DPP-M0 RJP30H1DPP-M0

Preliminary Datasheet RJP30H1DPD R07DS0465EJ0200Silicon N Channel IGBT Rev.2.00High speed power switching Jun 15, 2011Features Trench gate and thin wafer technology (G6H-II series) High speed switching: tr = 80 ns typ., tf = 150 ns typ. Low collector to emitter saturation voltage: VCE(sat) = 1.5 V typ. Low leak current: ICES = 1 A max. Outline RENES

 5.2. Size:151K  renesas
 r07ds0465ej rjp30h1dpd.pdf

RJP30H1DPP-M0 RJP30H1DPP-M0

Preliminary Datasheet RJP30H1DPD R07DS0465EJ0200Silicon N Channel IGBT Rev.2.00High speed power switching Jun 15, 2011Features Trench gate and thin wafer technology (G6H-II series) High speed switching: tr = 80 ns typ., tf = 150 ns typ. Low collector to emitter saturation voltage: VCE(sat) = 1.5 V typ. Low leak current: ICES = 1 A max. Outline RENES

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