ME60N04-G. Аналоги и основные параметры
Наименование производителя: ME60N04-G
Тип транзистора: MOSFET
Полярность: N
Предельные значения
Pd ⓘ - Максимальная рассеиваемая мощность: 30 W
|Vds|ⓘ - Максимально допустимое напряжение сток-исток: 40 V
|Vgs|ⓘ - Максимально допустимое напряжение затвор-исток: 20 V
|Id| ⓘ - Максимально допустимый постоянный ток стока: 39 A
Tj ⓘ - Максимальная температура канала: 150 °C
Электрические характеристики
tr ⓘ - Время нарастания: 13 ns
Cossⓘ - Выходная емкость: 130 pf
RDSonⓘ - Сопротивление сток-исток открытого транзистора: 0.012 Ohm
Тип корпуса: TO252
Аналог (замена) для ME60N04-G
- подборⓘ MOSFET транзистора по параметрам
ME60N04-G даташит
me60n04 me60n04-g.pdf
ME60N04/ME60N04-G N- Channel 40V (D-S) MOSFET GENERAL DESCRIPTION FEATURES The ME60N04 is the N-Channel logic enhancement mode power RDS(ON) 12m @VGS=10V field effect transistors are produced using high cell density DMOS RDS(ON) 17m @VGS=4.5V trench technology. This high density process is especially tailored to Super high density cell design for extremely low RDS(
me60n03a.pdf
ME60N03A 25V N-Channel Enhancement Mode MOSFET VDS=25V RDS(ON), Vgs@10V,Ids@30A = 8.5m RDS(ON), Vgs@4.5V,Ids@30A =13m FEATURES Advanced trench process technology High density cell design for ultra low on-resistance Specially designed for DC/DC converters and motor drivers Fully characterized avalanche voltage and current PIN CONFIGURATION (TO-252) Top View Absolute
me60n03.pdf
ME60N03 30V N-Channel Enhancement Mode MOSFET VDS=30V RDS(ON), Vgs@10V,Ids@30A = 8.5m RDS(ON), Vgs@4.5V,Ids@20A =13m FEATURES Advanced trench process technology High density cell design for ultra low on-resistance Specially designed for DC/DC converters and motor drivers Fully characterized avalanche voltage and current PIN CONFIGURATION (TO-252) Top View Absolute M
me60n03 me60n03-g.pdf
ME60N03/ME60N03-G 30V N-Channel Enhancement Mode MOSFET -g GENERAL DESCRIPTION FEATURES The ME60N03 is the N-Channel logic enhancement mode power RDS(ON) 8.5m @VGS=10V field effect transistors are produced using high cell density DMOS RDS(ON) 13m @VGS=4.5V trench technology. This high density process is especially tailored to Super high density cell design for extre
Другие IGBT... ME50N10, ME50N10-G, ME55N06, ME55N06-G, ME5602D-G, ME60N03S, ME60N03S-G, ME60N04, STP75NF75, ME6600D-G, ME6606D-G, ME6612D-G, ME6874, ME6874-G, ME70N03S, ME70N03S-G, ME70N10T
History: UTT25P10L-TQ2-T
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