AM82731-006 Datasheet and Replacement
Type Designator: AM82731-006
Material of Transistor: Si
Polarity: NPN
Maximum Collector Power Dissipation (Pc): 6 W
Maximum Collector-Base Voltage |Vcb|: 50 V
Maximum Collector-Emitter Voltage |Vce|: 50 V
Maximum Emitter-Base Voltage |Veb|: 3.5 V
Maximum Collector Current |Ic max|: 1.8 A
Max. Operating Junction Temperature (Tj): 200 °C
Transition Frequency (ft): 3100 MHz
Forward Current Transfer Ratio (hFE), MIN: 10
Noise Figure, dB: -
Package: SO42
AM82731-006 Datasheet (PDF)
am82731-003.pdf
AM82731-003RF & MICROWAVE TRANSISTORSS-BAND RADAR APPLICATIONS.REFRACTORY/GOLD METALLIZATION.EMITTER SITE BALLASTED.10:1 VSWR CAPABILITY.LOW THERMAL RESISTANCE.INPUT/OUTPUT IMPEDANCE MATCHING.OVERLAY GEOMETRY.METAL/CERAMIC HERMETIC PACKAGE.400 x .400 2NLFL (S042).POUT 3.0 W. MIN. WITH 5.7 dB GAIN=hermetically sealed.BANDWIDTH 400 MHz=ORDER CODE BRANDINGAM 82731
am82731-05.pdf
AM82731-050RF & MICROWAVE TRANSISTORSS-BAND RADAR APPLICATIONS.REFRACTORY/GOLD METALLIZATION.EMITTER SITE BALLASTED.RUGGEDIZED VSWR 3:1 @ 1 dB OVER-DRIVE.LOW THERMAL RESISTANCE.INPUT/OUTPUT MATCHING.OVERLAY GEOMETRY.400 x .400 2LFL (S036).METAL/CERAMIC HERMETIC PACKAGEhermetically sealed.P 50 W MIN. WITH 6 dB GAINOUT =ORDER CODE BRANDINGAM82731-050 82731-50DESC
am82731-025.pdf
AM82731-025RF & MICROWAVE TRANSISTORSS-BAND RADAR APPLICATIONS.LOW PARASITIC, DOUBLE LEVEL MET-AL DESIGN.REFRACTORY/GOLD METALLIZATION.EMITTER SITE BALLASTED.3:1 VSWR @ 1 dB OVERDRIVE.LOW RF THERMAL RESISTANCE.INPUT/OUTPUT IMPEDANCE MATCHING.400 x .400 2LFL (S036).OVERLAY GEOMETRYhermetically sealed.METAL/CERAMIC HERMETIC PACKAGEORDER CODE BRANDING.P 25 W MIN. WITH
Datasheet: 2N3192 , 2N3193 , 2N3194 , 2N3195 , 2N3196 , 2N3197 , 2N3198 , 2N3199 , MJE340 , 2N320 , 2N3200 , 2N3201 , 2N3202 , 2N3203 , 2N3204 , 2N3205 , 2N3206 .
History: 2N477 | NA11EI | 3DG1473 | HN1C03F
Keywords - AM82731-006 transistor datasheet
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History: 2N477 | NA11EI | 3DG1473 | HN1C03F
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